Electronics fail when heat has nowhere to go. A thermal interface material (TIM) fills the microscopic air gaps between a hot component and its heatsink, replacing insulating air with a conductive path. The trick is matching the TIM format to the gap, the pressure available and how often you need to rework it.
Thermal pads
Soft, pre-formed silicone pads fill larger or uneven gaps (typically 0.5–5 mm) with low assembly pressure. They are clean to handle, electrically insulating and reworkable — the default for gap-filling between PCBs and chassis.
Gels and grease
Thermal gels and grease wet out a thin bond line for the lowest thermal resistance on flat, tight interfaces such as CPU/GPU dies. Gels can be dispensed and cured for volume production; grease is simple but can pump out over thermal cycles.
Phase-change and liquid metal
Phase-change materials are solid for handling and soften at operating temperature to fill the interface. Liquid metal delivers the highest conductivity of all, but is electrically conductive and must be confined carefully — strictly for performance-critical, controlled assemblies.
How to choose
- Large or uneven gap, low pressure → thermal pad.
- Flat, tight interface, lowest resistance → gel or grease.
- Handling-friendly with good performance → phase-change.
- Maximum conductivity, controlled design → liquid metal.
- Always check electrical isolation requirements and rework needs.
Greenevo Synergy supplies the full TIM range — pads, gels, grease, phase-change and more — and can help you trade off conductivity, gap and process.